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| Image | PART NUMBER | Manufacturer | IN STOCK | PACKING | Description | RFQ |
|---|---|---|---|---|---|---|
 |
ID106 |
iBASE Technology | 3116 | Box | FC, 3.1W AMPLIFIER BOARD, 12V DC |
RFQ |
|
LCM CABLE |
iBASE Technology | 3790 | Box | AC, IIO2 LCM MODULE CABLE (C501E |
RFQ |
|
USB-74B |
iBASE Technology | 3075 | Box | AC, INTERNAL USB 2.0 CABLE, 2-PO |
RFQ |
|
IB881R-PW |
iBASE Technology | 2791 | Box | FC, ATX POWER BOARD FOR IB881 SE |
RFQ |
|
IB881R-SW |
iBASE Technology | 3945 | Box | FC, ATX POWER SWITCH BOARD FOR I |
RFQ |
 |
FWA8208-HD |
iBASE Technology | 2935 | Box | AC, 2.5 DUAL HDD-BRT-KIT + CABL |
RFQ |
|
ID108 |
iBASE Technology | 2611 | Box | FC, 6W AMPLIFIER BOARD, 12V DC-I |
RFQ |
|
IP117 |
iBASE Technology | 2249 | Box | FC, PCIE(16X) X 1 RISER CARD, NO |
RFQ |
|
HEATSINK CPU BGA1310 |
iBASE Technology | 3371 | Box | AC, CPU HEATSINK BGA1310 FOR MBN |
RFQ |
|
RG1100 |
iBASE Technology | 2711 | Box | AC, COOLER HEATSINK FOR INTEL SO |
RFQ |
|
ID724 |
iBASE Technology | 2755 | Box | LVDS/DVI EXTENSION CARD |
RFQ |
|
H052LGA1155001000P |
iBASE Technology | 3944 | Box | AC, COOLER HEATSINK FOR INTEL SO |
RFQ |
|
HEATSINK CPU LGA1156 |
iBASE Technology | 2794 | Box | AC, CPU HEATSINK LAG1156 FOR MB9 |
RFQ |
|
IP430 |
iBASE Technology | 2137 | Box | FC, PCIE(16E) TO PCIE(8X) X 1 SL |
RFQ |
|
ECC-01008-02-GP |
iBASE Technology | 2306 | Box | AC, COOLER HEATSINK FOR INTEL RP |
RFQ |
|
IIO2 |
iBASE Technology | 2672 | Box | AC, 16X2 LCM MODULE WITH 4 BUTTO |
RFQ |
|
H052SK1156ECCS000P |
iBASE Technology | 2005 | Box | AC, COOLER HEATSINK FOR INTEL SO |
RFQ |
|
ID386 |
iBASE Technology | 2011 | Box | FC, XILINX XC3S200AN FPGA THRU L |
RFQ |
|
ID460 |
iBASE Technology | 2038 | Box | AC, DC CONVERTER, INPUT +19V, OU |
RFQ |
|
IIO |
iBASE Technology | 2158 | Box | AC, 16X2 LCM MODULE WITH 5 BUTTO |
RFQ |
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