Thermal - Adhesives, Epoxies, Greases, Pastes - Carrysemi Technology Co., Ltd.

PART NUMBER	Manufacturer	IN STOCK	PACKING	Description	RFQ
8349TFM-25ML	MG Chemicals	3608	Bulk	THERMAL ADHESIVE 25ML	- + RFQ
65-00-TC50-0010	Parker Chomerics	3505	Bulk	THERM-A-GAP TC50 5.2W/M-K 10CC	- + RFQ
8329TFS-50ML	MG Chemicals	2933	Bulk	SLOW CURE THERM COND ADH FLOW	- + RFQ
A17170-01	Laird Technologies - Thermal Materials	2396	Box	TPUTTY 508	- + RFQ
1379310	LOCTITE	3055	Bulk	CATALYST 9 (27G)	- + RFQ
65-02-GEL75-0030	Parker Chomerics	2717	Bottle	THERM-A-GAP GEL 75 7.5 W/M-K DIS	- + RFQ
TG-NSP25-60	t-Global Technology	2223	Box	SILICONE FREE THERMAL PUTTY 60CC	- + RFQ
1978-1	Techspray	3311	Bulk	SILICONE FREE HEAT SINK	- + RFQ
832TC-450ML	MG Chemicals	3400	Box	THERMALLY CONDUCTIVE EPOXY	- + RFQ
65-00-T670-0080	Parker Chomerics	3940	Bulk	T670 3W/M-K GREASE 80CC JAR	- + RFQ
TG-N909-1000	t-Global Technology	2526	Bulk	NON-SILICONE THERMAL GREASE 1KG	- + RFQ
1586134	LOCTITE	3883	Bulk	ECCOBOND 56C-CAT 9 KIT, 140.5GM	- + RFQ
TC3-10G	Chip Quik Inc.	102	Bulk	HEAT SINK THERMAL COMPOUND	- + RFQ
65-00-T630-0300	Parker Chomerics	3583	Bulk	THERM-A-GAP T630 0.7W/M-K 300CC	- + RFQ
P0200-19	Littelfuse Inc.	3157	Bulk	HEAT SINK COMP. SARAN PKG 2GR	- + RFQ
HSC67-6G	CAIG Laboratories, Inc.	2405	Bulk	SILICONE HEAT SINK COMPOUND SQUE	- + RFQ
TC3-1G	Chip Quik Inc.	2683	Bulk	HEAT SINK THERMAL COMPOUND	- + RFQ
TC1-10G	Chip Quik Inc.	3397	Bulk	HEAT SINK COMPOUND - HIGH DENSIT	- + RFQ
BT-102-50M	Wakefield-Vette	3016	Bulk	TOUGHENED, FLEXIBLE ADHESIVE SYS	- + RFQ
BT-101-50M	Wakefield-Vette	3970	Bulk	NON-SAG 5 MINUTE BONDATHERM EPOX	- + RFQ

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