| Image | PART NUMBER | Manufacturer | IN STOCK | PACKING | Description | RFQ |
|---|---|---|---|---|---|---|
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960-27-28-S-AB-0 |
Wakefield-Vette | 3746 | Box | HEATSINK 27X28MM SIDE PUSH PIN |
RFQ |
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960-31-21-S-AB-0 |
Wakefield-Vette | 2792 | Box | HEATSINK 31X21MM SIDE PUSH PIN |
RFQ |
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960-31-21-D-AB-0 |
Wakefield-Vette | 3509 | Box | HEATSINK 31X21MM DIA PUSH PIN |
RFQ |
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960-31-23-S-AB-0 |
Wakefield-Vette | 3582 | Box | HEATSINK 31X23MM SIDE PUSH PIN |
RFQ |
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960-31-23-F-AB-0 |
Wakefield-Vette | 3504 | Box | HEATSINK 31X23MM FRONT PUSH PIN |
RFQ |
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960-29-28-F-AB-0 |
Wakefield-Vette | 4000 | Box | HEATSINK 29X28MM FRONT PUSH PIN |
RFQ |
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960-29-28-D-AB-0 |
Wakefield-Vette | 2078 | Box | HEATSINK 29X28MM DIA PUSH PIN |
RFQ |
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960-29-28-S-AB-0 |
Wakefield-Vette | 3537 | Box | HEATSINK 29X28MM SIDE PUSH PIN |
RFQ |
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694-100 |
Wakefield-Vette | 2586 | Box | HEATSINK TO247 W/CLIP 100MM |
RFQ |
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960-29-33-F-AB-0 |
Wakefield-Vette | 2808 | Box | HEATSINK 29X33MM FRONT PUSH PIN |
RFQ |
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960-29-33-S-AB-0 |
Wakefield-Vette | 2574 | Box | HEATSINK 29X33MM SIDE PUSH PIN |
RFQ |
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960-29-33-D-AB-0 |
Wakefield-Vette | 3554 | Box | HEATSINK 29X33MM DIA PUSH PIN |
RFQ |
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SKV585811-CU |
Wakefield-Vette | 2128 | Bulk | COPPER HEATSINK 57.9X59X11MM |
RFQ |
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SKV909010-CU |
Wakefield-Vette | 2913 | Bulk | COPPER HEATSINK 90X90X10MM |
RFQ |
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125493 |
Wakefield-Vette | 2151 | Box | 4.75X12 EXTRUSION 5410 XX1025 |
RFQ |
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647064 |
Aavid, Thermal Division of Boyd Corporation | 2431 | Tray | INTEL XEON CPU COOLER 2U |
RFQ |
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125526 |
Wakefield-Vette | 3154 | Box | 5WX12 EXTRUSION 16082 XX3560-2 |
RFQ |
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ACC-HS4-SET |
Enclustra FPGA Solutions | 3864 | Box | ACC HEATSINK ME ACC-HS4 |
RFQ |
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342946 |
Aavid, Thermal Division of Boyd Corporation | 2309 | Tray | COPPER HEATSINK 60X60X22MM |
RFQ |
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125488 |
Wakefield-Vette | 2084 | Box | 4.75X36 EXTRUSION 4530 XX1024 |
RFQ |
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