+86-13546881014 kyle
dandan@carrysemi.com
CUI Devices HSB01-080808
- Part No.:
- HSB01-080808
- Manufacturer:
- CUI Devices
- Package:
- BGA
- Description:
- HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
- In Stock:
- 2560
- Quantity:
- Add To Cart
- Quick response, quick quotation
- Flash shipment, no worries after sales
- Original channel, guarantee of the authentic products
Please send RFQ.
Mainland Office: 4507, Duhuixuan, No. 3018 Shennan Avenue, Huahang Community, Huaqiang North Street, Futian District, Shenzhen
Hong Kong:FLAT/RM 1101D11/FLIPPO SUN PLAZA28 CANTON ROADTSIM SHA TSUI KL
-
Tel
+86-13546881014