| Image | PART NUMBER | Manufacturer | IN STOCK | PACKING | Description | RFQ |
|---|---|---|---|---|---|---|
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HSS-B20-05H |
CUI Devices | 2715 | Bag | HEATSINK TO-220 9.8W ALUMINUM |
RFQ |
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335814B00000G |
Aavid, Thermal Division of Boyd Corporation | 3375 | Bulk | HEAT SINK |
RFQ |
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335714B00000G |
Aavid, Thermal Division of Boyd Corporation | 2733 | Bulk | HEAT SINK |
RFQ |
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V5236BP-T |
Assmann WSW Components | 2170 | Bulk | HEATSINK ANOD ALUM SOT-32/TO-220 |
RFQ |
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254-195ABPE |
Wakefield-Vette | 3537 | Bulk | HEATSINK TO PKG FOLDED FIN |
RFQ |
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XL25-35-35-10-T1-0.25 |
t-Global Technology | 2745 | Tray | CERAMIC HEAT SPREADER 35X35MM GR |
RFQ |
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624-35AB |
Wakefield-Vette | 3489 | Bulk | HEATSINK FOR 21MM BGA |
RFQ |
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625-25AB |
Wakefield-Vette | 2834 | Bulk | HEATSINK FOR 25MM BGA |
RFQ |
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V2136N1-F |
Assmann WSW Components | 3702 | Bulk | HEATSINK CPU W/ADHESIVE STAMPED |
RFQ |
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HSE-B20381-056H |
CUI Devices | 2009 | Box | HEAT SINK, EXTRUSION, TO-220, 38 |
RFQ |
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XL25-40-40-5-T1-0.25 |
t-Global Technology | 3446 | Tray | CERAMIC HEAT SPREADER 40X40MM GR |
RFQ |
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630-25AB |
Wakefield-Vette | 2940 | Bulk | HEATSINK FOR 35MM BGA |
RFQ |
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624-45AB |
Wakefield-Vette | 2670 | Bulk | HEATSINK CPU 21MM SQ W/OUT ADH |
RFQ |
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578205B00000G |
Aavid, Thermal Division of Boyd Corporation | 2532 | Bag | HEATSINK TO-5 .5 BLACK |
RFQ |
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CSM222-30AE |
Ohmite | 2649 | Box | HEATSINK BLACK ANODIZED |
RFQ |
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628-20AB |
Wakefield-Vette | 3652 | Bulk | HEATSINK FOR 45MM BGA |
RFQ |
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593202B03400G |
Aavid, Thermal Division of Boyd Corporation | 2309 | Bulk | BOARD LEVEL HEAT SINK |
RFQ |
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642-35AB |
Wakefield-Vette | 2591 | Bulk | HEATSINK FOR 35MM BGA |
RFQ |
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HSS28-B20-P39 |
CUI Devices | 2026 | Bag | HEAT SINK, STAMPING, TO-218/TO-2 |
RFQ |
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532602B00000 |
Aavid, Thermal Division of Boyd Corporation | 2359 | Bulk | BOARD LEVEL HEAT SINK |
RFQ |
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