| Image | PART NUMBER | Manufacturer | IN STOCK | PACKING | Description | RFQ |
|---|---|---|---|---|---|---|
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HSE-B508-045H |
CUI Devices | 2954 | Box | HEAT SINK, EXTRUSION, TO-220, 50 |
RFQ |
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HSE-B20630-040H-01 |
CUI Devices | 2387 | Box | HEAT SINK, EXTRUSION, TO-220, 63 |
RFQ |
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690-3B |
Wakefield-Vette | 3072 | Bulk | HEATSINK EXTRUSION |
RFQ |
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HSE-B500-04H |
CUI Devices | 2197 | Box | HEAT SINK, EXTRUSION, TO-220, 50 |
RFQ |
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624-25ABT1E |
Wakefield-Vette | 3772 | Bulk | HEATSINK FOR 21MM BGA |
RFQ |
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HSE-B20630-040H |
CUI Devices | 2266 | Box | HEAT SINK, EXTRUSION, TO-220, 63 |
RFQ |
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625-60AB |
Wakefield-Vette | 2015 | Bulk | HEATSINK FOR 25MM BGA |
RFQ |
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628-25AB |
Wakefield-Vette | 3279 | Bulk | HEATSINK FOR 45MM BGA |
RFQ |
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634-10AB |
Wakefield-Vette | 2349 | Bulk | HEATSINK TO-220 VERT MT BLK 1 |
RFQ |
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HSE-B18317-035H-01 |
CUI Devices | 3908 | Box | HEAT SINK, EXTRUSION, TO-218, 31 |
RFQ |
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HSE-B18381-035H-02 |
CUI Devices | 2492 | Box | HEAT SINK, EXTRUSION, TO-218, 38 |
RFQ |
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630-45AB |
Wakefield-Vette | 2737 | Bulk | HEATSINK FOR BGAS FIN HGT .45 |
RFQ |
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529801B02100G |
Aavid, Thermal Division of Boyd Corporation | 2208 | Bulk | BOARD LEVEL HEAT SINK |
RFQ |
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634-15AB |
Wakefield-Vette | 2830 | Bulk | HEATSINK SLIM VERT BLACK TO-220 |
RFQ |
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CSM221-28AE |
Ohmite | 3527 | Box | HEATSINK BLACK ANODIZED |
RFQ |
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V2200N1-F-LP |
Assmann WSW Components | 3142 | Bulk | HEATSINK CPU W/ADHESIVE STAMPED |
RFQ |
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PH3N-101.6-38.1-0.062-1A |
t-Global Technology | 3727 | Bulk | PH3N NANO 101.6X38.1X0.062MM |
RFQ |
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624-35ABT1E |
Wakefield-Vette | 3132 | Bulk | HEATSINK FOR 21MM BGA |
RFQ |
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630-25ABT3 |
Wakefield-Vette | 2234 | Bulk | HEATSINK FOR 35MM BGA |
RFQ |
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630-25ABT4E |
Wakefield-Vette | 3775 | Bulk | HEATSINK FOR 35MM BGA |
RFQ |
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